MTLee
Featured on Journal Cover
Recent publication "Eco-Friendly and Particle-Free Copper Ionic Aqueous Precursor for In Situ Low Temperature Photothermal Synthesizing and Patterning of Highly Conductive Copper Microstructures on Flexible Substrate" is selected to be featured on the front cover of Advanced Engineering Materials https://onlinelibrary.wiley.com/doi/10.1002/adem.202270009